? semiconductor components industries, llc, 2015 february, 2015 ? rev. 0 1 publication order number: nsr02f30mx/d NSR02F30MXT5G 200 ma, 30 v schottky barrier diode these schottky barrier diodes are optimized for low forward voltage drop and low leakage current that offers the most optimal power dissipation in applications. they are housed in a spacing saving x3dfn 0201 package ideal for space constraint applications. features ? low forward voltage drop ? 500 mv (typ.) @ i f = 200 ma ? low reverse current ? 20 a (typ.) @ v r = 30 v ? 200 ma of continuous forward current ? esd rating ? human body model: class 2 ? machine model: class m3 ? cdm: class iv ? high switching speed ? these devices are pb?free, halogen free/bfr free and are rohs compliant typical applications ? lcd and keypad backlighting ? camera photo flash ? buck and boost dc?dc converters ? reverse voltage and current protection ? clamping and protection maximum ratings rating symbol value unit reverse voltage v r 30 v forward current (dc) i f 200 ma forward surge current (60 hz @ 1 cycle) i fsm 2 a repetitive peak forward current (pulse wave = 1 sec, duty cycle = 66%) i frm 1 a esd rating: human body model machine model esd 2 ? 4 >400 kv v stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1 cathode 2 anode www. onsemi.com device package shipping ? ordering information NSR02F30MXT5G x3dfn (pb?free) 15000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification s brochure, brd8011/d. x3dfn2 case 152af j = specific device code = (rotated 180 ) m = month code marking diagram pin 1 m j
NSR02F30MXT5G www. onsemi.com 2 table 1. thermal characteristics rating symbol max unit thermal resistance junction?to?ambient (note 1) total power dissipation @ t a = 25 c r ja p d 695 180 c/w mw storage temperature range t stg ?55 to +125 c junction temperature t j +125 c 1. mounted onto a 4 in square fr?4 board 100 mm sq. 2 oz. cu 0.06 thick single sided. operating to steady state. table 2. electrical characteristics (t a = 25 c unless otherwise noted) parameter test conditions symbol min typ max unit reverse leakage v r = 10 v i r ? ? 15 a reverse leakage v r = 30 v i r ? 20 50 a forward voltage i f = 1 ma v f ? 155 mv forward voltage i f = 10 ma v f ? 250 290 mv forward voltage i f = 100 ma v f ? 375 490 mv forward voltage i f = 200 ma v f ? 500 600 mv total capacitance v r = 1.0 v, f = 1.0 mhz c t ? 6 8 pf reverse recovery time i f = i r = 10 ma, i r(rec) = 1.0 ma, figure 2 t rr ? 2.4 3 ns figure 1. recovery time equivalent test circuit figure 2. peak forward recover voltage definition
NSR02F30MXT5G www. onsemi.com 3 typical characteristics figure 3. forward voltage figure 4. leakage current v f , forward voltage (v) v r , reverse voltage (v) 0.5 0.4 0.3 0.2 0.1 0 0.1 1 10 100 1000 30 25 20 15 10 5 0 1.e?08 figure 5. total capacitance figure 6. forward surge current v r , reverse voltage (v) t p (msec) 30 25 20 15 10 5 0 0 1 3 4 5 7 9 10 1000 100 10 1 0.1 0.01 0.001 0 2 4 6 8 10 12 i f , forward current (ma) i r , reverse current (a) c t , total capacitance (pf) i fsm (a) 150 c 125 c 85 c 25 c ?25 c 125 c 85 c 25 c ?25 c 1.e?07 1.e?06 1.e?05 1.e?04 1.e?03 1.e?02 1.e?01 t a = 25 c 2 6 8 t a = 25 c prior to surge based on square wave current figure 7. thermal response pulse time (sec) 0.01 0.001 0.0001 0.00001 0.000001 0.1 0.0000001 0.1 10 100 1000 r(t) ( c/w) duty cycle = 50% 1 1 10 100 1000 20% 10% 5% 2% 1% single pulse
NSR02F30MXT5G www. onsemi.com 4 package dimensions x3dfn2, 0.62x0.32, 0.355p, (0201) case 152af issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. a b e d bottom view b e 2x l 2x 2x 0.035 c top view 2x 0.035 c 2x a a1 0.05 c 0.05 c c seating plane side view dim min max millimeters a 0.25 0.33 a1 ??? 0.05 b 0.22 0.28 d 0.62 bsc e 0.32 bsc e 0.355 bsc l 0.17 0.23 mounting footprint* dimensions: millimeters 0.74 1 0.30 0.31 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 2 1 see application note and8398/d for more mounting details a m 0.05 b c a m 0.05 b c 2x 2x recommended pin 1 indicator (optional) on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any product s herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any part icular purpose, nor does sci llc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 nsr02f30mx/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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